Equipment and Process Capability

Further information is available on:

• Facility Layout

• Photomask Generation

• Cleaning and Wet Etching

• Oxidation/Diffusion

• LPCVD

• Rapid Thermal Processing

• Photolithography

• Plasma Etching

• Metallization

• Ion Implantation

• Process Monitoring

• Wafer Level Test

• Dicing and Packaging