Lithography is carried out using a Karl-Suss MA6 mask aligner, which can accept substrates ranging from small fragments to 100 mm diameter wafers. 150 mm wafers could be accomodated by the simple addition of a larger chuck.
Using HPR504 positive resist, feature sizes as small as 0.8 µm have been printed using chrome masks. With masks produced in house at Carleton the useful minimum feature size is 2.5 µm, with 2.5 µm minimum spacing and level-to-level registration.