Michel S. Nakhla is a Chancellor’s Professor of Electrical Engineering at Carleton University. He received the M.A.Sc. and Ph.D. degrees in Electrical Engineering from University of Waterloo, Ontario, Canada.CU Department of Electronics
Michel S. Nakhla is a Chancellor’s Professor of Electrical Engineering at Carleton University. He received the M.A.Sc. and Ph.D. degrees in Electrical Engineering from University of Waterloo, Ontario, Canada, in 1973 and 1975, respectively. From 1976-88 he was with Bell-Northern Research, Ottawa, Canada, as the senior manager of the computer-aided engineering group. In 1988, he joined Carleton University, Ottawa, Canada as a professor and the holder of the Computer-Aided Engineering Senior Industrial Chair established by Bell-Northern Research and the Natural Sciences and Engineering Research Council of Canada. He is the founder of the high-speed CAD research group at Carleton University and is a frequent invited speaker on the topic of high-speed interconnects. He is one of the first pioneers to introduce the concept of Harmonic Balance, which is the backbone of current RF and microwave circuit simulators. He is the co-recipient of the IEEE 2002 Microwave prize in recognition of the most significant contribution by a published paper to the field of interest to the Microwave Theory and Techniques Society. He was awarded the IEEE Fellowship in 1998 for his contributions to the development of advanced computer-aided design techniques for microwave circuits and high-speed interconnects. He has authored and co-authored more than 300 technical papers that contributed significantly to the evolution of the Design Automation field.
He is serving on various international committees, including the Executive Committee of the IEEE International Signal Propagation on Interconnects Workshop (SPI), the Technical Program Committee of the IEEE International Microwave Symposium (IMS), the Technical Program Committee of the IEEE Topical Meeting on Electrical Performance of Electronic Packaging and the CAD committee (MTT-1) of the IEEE Microwave Theory and Techniques Society. He is Associate Editor of the IEEE Transactions on Advanced Packaging and served as Associate Editor of the IEEE Transactions on Circuits and Systems and as Associate Editor of the Circuits, Systems and Signal Processing Journal. He was the general Co-Chair of the 2002 and 2003 IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP). He served as member of the Technical Coordinating Committee of the Canadian Microelectronic Center of Excellence (MICRONET). He is on the Review Boards of various technical journals, including the IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Circuits and Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology and the IEEE Microwave and Wireless Components Letters in addition to several non-IEEE international publications. He has also served as a member of many Canadian and international government-sponsored research grants selection panels. He serves as a technical consultant for several industrial organizations.
You can find the list of publications at the links below.