Tom Smy

1. P. Gunupudi, R. Khazaka, T. Smy, D. Celo and M. Nakhla, "Passive Multidimensional Timedomain Macromodels For Highspeed Transmission Line Networks", Accepted for the December Issue of IEEE Trans. MTT. (C,M)

2. G. Romo, T. Smy, "Circuit Model Representation of Periodic Boundary Conditions for Modelling Photonic Crystals using the Transmission Line Matrix Method", Accepted by the Journal of Applied Physics (May 2003) (and chosen for the Virtual Journal of Nanoscale Science and Technology). (Ci,N)

3. Romo G, Smy T, Walkey D, Reid B, "Modeling facet heating in ridge lasers", Microelectronics Reliability 43 (1): 99-110 Jan 2003. (N, M)

4. D.J. Walkey, D. Celo, T.J. Smy, "A Simplified Model for the Effect of Inter-finger Metal on Maximum Temperature Rise in a Multi-Finger Bipolar Transistor",IEEE T Comput AID D 22 (1): 15-25 Jan 2003. (C,M)

5. D. J. Walkey, T. J. Smy, R. Dickson , J. Brodsky, D. Zweidinger, R. Fox, "Equivalent circuit modeling of static substrate thermal coupling using VCVS representation", IEEE JSSC 37 (9): 1198-1206 Sep 2002.(M,C)

6. G, Knight, T, Smy, "Modelling roughness, grain and confinement effects on transport in embedded metallic films", Microelectron Eng. 64 (1-4): 417-428 Oct 2002. (/M,N)

7. Douglas Vick, Tom Smy, Michael Brett, "Growth Behaviour Of Evaporated Porous Thin Films", J Mater Res 17 (11): 2904-2911 Nov 2002.(N)

8. T. Smy, S. K. Dew, R. V. Joshi, "Modeling 3D effects of substrate topography on step coverage and film morphology of thin metal films", Thin Solid Films, 415 (1-2): 32-45 Aug 1 2002 (N,M)

9. B. Dick, M. Brett, T. Smy, M. Belov, M. Freeman, "Periodic submicrometer structures by sputtering", JVSTB, 19(5) pp. 1813-1819 Sep 2001. (M, N)

10. D.J. Walkey, T.J. Smy, C. Reimer, M.Schroter, H.Tran, D. Marchesan "Modeling Thermal Resis-tance in Trench-Isolated Bipolar Technologies Including Trench Heat Flow", Solid-State Electronics, Volume 46, Issue 1, January 2002, Pages 7-17. (M,C)

11. T. Smy, D. Walkey, S. Dew, "Transient 3D heat flow analysis for integrated circuit devices using the transmission line matrix method on a quad tree mesh", Solid-State Electronics 45 (7), pp. 1137-1148, Jul, 2001. (C,M)

12. J. Rogers, V. Leventets, C. Pawlowicz, N.Tarr, T. Smy and C. Plett, "Post-Processed Cu Inductors with Application to a Completely Integrated 2 Ghz VCO", IEEE Trans on Electron Devices, Vol. 48, No. 6, p. 1284, June 2001,(M,N)

13. D.J. Walkey, T.J. Smy, D. Marchesan, H. Tran, M. Schroter, "Scalable thermal model for trench is isolated bipolar transistors", Solid-State Electronics 2000 Aug Vol.44 No.8 p. 1373. (M)

14. T. Smy, D. Walkey, K.D. Harris, and M.J. Brett "Thin film microstructure and thermal transport simulation using 3D-Films", Thin Solid Films, 391(1), July, 2001. pp. 88-100. (N,M)

15. K.D. Harris, D. Vick, E.J. Gonzales, T. Smy, K. Robbie, and M.J. Brett, "Porous thin films for thermal barrier coatings", Surf Coat Tech, 138, (2-3), pp. 185-191 Apr, 2001 (N)

16. T. Smy, D. Walkey and S. Dew, "A 3D thermal simulation tool for integrated devices – Atar", IEEE T Comput Aid D 20 (1): 105-115 Jan 2001 (M,C)

17. T. Smy, S. K. Dew and R.V. Joshi, "Efficient modeling of thin film deposition for low sticking using a 3D microstructural simulator", J. Vac. Sci. Technol. B, 2001 Jan-Feb Vol.19 No.1 Pages 251 - 261. (N)

18. K.D. Harris, M.J. Brett, T.J. Smy, C. Backhouse, "Microchannel surface area enhancement using porous thin films", J. Electrochem, 2000 MAY Vol.147 No.5 Pages 2002 - 2006. (M,N)

19. Ming Li, S.K. Dew, M.J. Brett, T. Smy, "Kinetic simulation of metal CVD on high aspect ratio features in modern VLSI processing", JVST B Vol 18, pp. 1343–1347, 2000. (N)

20. T. Smy, D. Vick, M. J. Brett, S. K. Dew, J. T. Wu, J. Sit, and K. Harris, "Three Dimensional Simulation of Film Microstructure Produced by Glancing Angle Deposition", J. Vac. Sci. Technol. A.,2000 Sep-Oct Vol.18No.5 Pages 2507 - 2512. (M)

21. B. Dick, M.J. Brett, T.J. Smy, M. Malac, and R.F. Egerton "Periodic magnetic microstructures by glancing angle deposition" J. Vac. Sci. Technol. A., 2000 JUL-AUG Vol.18 No.4 Pt.2 Pages 1838 -1844. (N,M)

22. C. J. Reimer, T. Smy, D. J. Walkey, B.C. Beggs and R. Surridge. "A Simulation Study of IC Layout Effects on Thermal Management of Die Attached GaAs ICs", IEEE Trans on CMPT, 2000 Jun Vol.23 No.2 Pages 341 - 351, (M,N)

23. L.J. Friedrich, S.K. Dew, M.J. Brett, T. Smy, "A Simulation Study of Copper Reflow Characteristics in Vias", IEEE Transactions on Semiconductor Manufacturing, Vol.12 No.3, pp. 353-365, Aug. 1999,. (M,N)

24. L.J. Friedrich, S.K. Dew, M. Brett, and T. Smy, "Integrating System and Feature Models to Study Copper Reflow", JVSTB Vol. 17, No. 1, pp. 186–193, 1999. (M,N)

25. D. Vick, L.J. Friedrich, S.K. Dew, M. Brett, K. Robbie, M. Seto, and T. Smy, "Self-shadowing and surface diffusion effects in obliquely deposited thin films", Thin Solid Films, Vol.349 No.1-2 Pages 303 - 303, July 30, 1999. (M,N)

26. T. Smy, R.V Joshi, N. Tait, S. K. Dew and M. J. Brett "An analysis of the role of high energy neutral bombardment in longthrow/collimated sputtering of refractory metal barrier layers", Journal of Applied Physics, vol. 84, no. 9, p. 5315. Nov. 1998. (N,M)

27. T. Smy, L.Tan, K. Chan, J.N. Broughton, R. N. Tait, S. K. Dew and M. J. Brett, "A simulation study of long throw sputtering for diffusion barrier deposition into high aspect vias and contacts", IEEE Elec. Dev. July 1998, Vol.45 No.7 Pages 1414 - 1425. (M,N)

28. T. Smy, L. Tan, S.S. Winterton, S.K. Dew and M.J. Brett, "Simulation of Sputter Deposition at High Pressures", JVSTA. 15(6), Nov/Dec 97 pp. 2847-2853. (M,N)

29. L.J. Friedrich, D.S. Gardner, S.K. Dew, M.J. Brett, and T.J. Smy "A study of the copper reflow process using the GROFILMS simulator", J. Vacuum Science Technol. B15, 1780-1787 (1997). (M,N)

30. T. Smy, L. Tan, S.K. Dew, and M.J. Brett, Y. Shacham-Diamand, M.Desilva, " Simulation of Elec-troless Deposition of Cu Thin Films for VLSI Metallization", J. Electrochem. Soc. Vol. 144, pp.2115-2122, June 1997. (N)

31. B.Dick, M.J. Brett, T. Smy, "Controlled Growth of Periodic Pillars by Glancing Angle Deposition", Submitted to JVSTB (N)

33. D. Celo, P. Gunupudi, R. Khazaka , D. J. Walkey, T. Smy and M. Nakhla "Very Fast Simulation of Steady-State Temperature Distributions in Electronic Components using Multi-Dimensional ModelReduction", submitted to IEEE Journal on Advanced Packages. (C,N,M)

34. X. Guo, D. Celo, P. Gunupudi, R. Khazaka , D. J. Walkey, T. Smy and M. Nakhla, "The Creation of Compact Thermal Models of Electronic Components Using Model Reduction", submitted to IEEECPMT. (C,N,M)

35. G. Romo and T. Smy, "Effecient Simulation of Photonic Crystals using TLM", submitted to Photon-ics & Nanostructures, Fundamentals and Applications.

36. T. Smy and M.J. Brett, "Modeling GLAD films using 3D-FILMS", Canadian Semiconductor Tech-nology Conference, Ottawa, Aug. 2003.

37. T.Smy, "Model Based Solutions to Metallization Microstructure: comparison of fill and barrier tech-niques ", Advanced Metals Short Course, Oct, University of California, Berkeley, For the years 1997-2004.

38. T. Smy, R.V.Joshi, S. K. Dew, M. J. Brett, "3D Microstructural Simulation of Thin Film Deposition for VLSI Interconnects", Int. Conf. on VMIC 2000, Santa Clara. (Best paper award).

39. L. J. Friedrich, D. S. Gardner, S. K. Dew, M. Brett, T. Smy, "Fundamental and Practical Studies of Copper Reflow Using Process Simulation", presented at the International Conference on Metallurgi-cal Coatings and Thin Films, San Diego CA, April 22, 1997.

40. S. Abdalla, P. Barrios, A. Delge, I. Golub, S. Janz, R. McKinnon, P. Poole, D. Celo, S. El-Mougy, S. Ng, S. Raymond, T. Smy, B. Syrett "Optical Switching in InGaAsP Waveguides Using Localized Index Gradients", 11th CSTC, Ottawa, 2003 (Ci,C)

41. P.D. Waldron, L. Winchiu, P. Chyurlia, T. Smy, I. Golub, D.-X. Xu, S. Janz, G. Tarr, P.E. Jessop, "An Electro-Optic Modulator in Silicon-on-Insulator" P.D. Waldron, L. Winchiu, P. Chyurlia, T. Smy, I. Golub, D.-X. Xu, S. Janz, G. Tarr, P.E. Jessop, 11th CSTC, Ottawa, 2003. (Ci,C)

42. T. Smy and R.V. Joshi, "Simulation Of The Deposition Of Bcc Metals Including Anistropic Effects Using 3D-Films", Advanced Metallization for ULSI applications, 2003. (N)

43. D. Celo, T. Smy and R.V. Joshi, "Backend Implications For Thermal Effects In 3d Integrated Soi Structures", Advanced Metallization for ULSI applications, 2003. (M,C,N)

44. G. Romo Luevano, T. Smy, "A Passive Circuit Representation of Boundary Conditions for Mod-elling Periodic Microwave Structures using the TLM Method", 2003 IEEE AP-S ISAPropagation, Columbus, Ohio, USA on June 22-27, 2003.(Ci,N)

45. P. Gunupudi, R. Khazaka, T. Smy, D. Celo and M. Nakhla, "Multidimensional Time-Domain Macro-models for Microwave Applications", 2003 International Microwave Symposium, Philadelphia, Penn-sylvania June 8-13, 2003 (C,N)

46. S. Janz, P. Barrios, A. Delge, I. Golub, P. Poole, W.R. McKinnon, S. Abdalla, D. Celo, S. El-Mougy, S. Ng, T.J. Smy, B. Syrett, "Digital optical switch based on fast thermal gradient switching in InGaAsP waveguides", OSA Integrated Photonics Research Topical Meeting, Washington, June, 2003.(C,Ci)

48. D.J. Walkey, D. Celo and T.J. Smy, "Prediction of Maximum Temperature Rise in Multi-Finger Transistor Structures Using Normalization", GaAsMANTECH, 2002, San. Fran. (M,N)

49. G. Romo, T.J. Smy, D.J. Walkey and B. Reid, "Thermal Model Requirements for Prediction of Facet Temperature in Electro-Optical- Thermal Simulation of Ridge Lasers", SEMITHERM, March 2002,San Fran., March 2002. (M,N)

50. N.G. Tarr, P.D. Waldron, T.J. Smy, P.E. Jessop and S. Janz, "Minimizing Thermal Effects in a Silicon-on-Insulator Mach-Zehnder Electro-Optic Switch", SPIE Opto Canada Conference, Ottawa,9-10 May 2002. (Ci,N)

51. G. Knight, T. Smy, and S. Crisnan, " Calculating current flow in deep-submicron and nanoscale metal structures" Advanced Metallization for ULSI applications, Montreal, Oct. 2001. (N,M)

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Last Modified: January 13, 2004